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  • Challenges In Moving Data In Chips
    How to ensure the right data arrives at a shared memory at the right time. The post Challenges In Moving Data In Chips appeared first on Semiconductor Engineering.

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  • Mitsubishi Electric shipping samples of four new trench SiC MOSFET bare dies for power semiconductors
    On 21 January, Tokyo-based Mitsubishi Electric Corp will starting shipping samples of four new trench silicon carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET) bare dies designed for use in power electronics equipment, such as electric vehicle (EV) traction inverters, onboard chargers, and power supply systems for renewable energy sources including solar power. The new power semiconductor […]

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