HW methods to throttle AI; M3D DRAM; interconnect signal-integrity analysis; 3D mask effects in high/hyper-NA EUV litho; compute-in-interconnect and memory; NbAs nanowire interconnects; and 3D conformal thin-film patterning. The post Chip Industry Technical Paper Roundup: July 28 appeared first on Semiconductor Engineering.

Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes photonic products for optical networks and lasers for industrial and consumer markets) says that president & CEO Michael Hurlston has been selected to receive the 2026 Optica i4 Individual Achievement Prize, recognizing his leadership and contributions to the global optics and photonics industry. […]