3D DRAM-on-GPU thermal design; multi-tier CFET self-heating and parasitics; 200G/λ silicon photonics; dry-deposited EUV and e-beam resists; neural-network-based SPICE modeling for 3nm; security-aware 3D CiM mapping; Pt-W absorbers for high-NA EUV masks. The post Chip Industry Technical Paper Roundup: Oct. 27 appeared first on Semiconductor Engineering.

Infineon Technologies AG of Munich, Germany is to supply what is said to be the world’s first 900V gallium nitride (GaN) monolithic bidirectional switches (BDS) to Enphase Energy Inc of Fremont, CA, USA (which supplies microinverter-based solar and battery systems) for deployment in its solid-state transformer (SST) power modules. By extending the operating voltage range […]